Concepedia

Nicholas G. Koopman

NG

1

Publications

13

Citations

1

H-Index

2005

Active since

Affiliations

North Carolina State University(Current)

Nicholas G. Koopman is an author at North Carolina State University specializing in engineering, computer engineering, and electronic packaging.

Top concepts

3D PrintingEngineeringMicroelectronicsMicrofabricationComputer EngineeringElectronic PackagingElectrical Engineering

Publications per year

2005–2005

1

Publications

1

Flip Chip Technology: A Method for Providing Known Good Die with High Density Interconnections

G.M. Adema, C.J. Berry, Nicholas G. Koopman et al. · 2005 · 13 citations

Flip Chip Technology, Engineering, Highest Interconnection Density +16

Rows per page

1–1 of 1