Concepedia

Karthik Arun Deo

KA

4

Publications

60

Citations

4

H-Index

2022

Active since

Affiliations

Binghamton University(Current)

Karthik Arun Deo is an author at Binghamton University specializing in electronic packaging, thermal engineering, and engineering.

Top concepts

EngineeringThermal EngineeringElectronic PackagingData ScienceDeep LearningHeat TransferMicrostructureMachine LearningThermal ModelingThermal Management

Publications per year

2022–2023

4

Publications

4

Reflow Recipe Establishment Based on CFD-Informed Machine Learning Model

Yangyang Lai, Jong Hwan Ha, Karthik Arun Deo et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2023 · 20 citations

A Deep Learning Approach for Reflow Profile Prediction

Yangyang Lai, J. Kataoka, Ke Pan et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 16 citations

Engineering, Machine Learning, Machine Learning Tool +18

Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods

Yangyang Lai, Chongyang Cai, Ke Pan et al. · 2022 · 12 citations

A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints

Karthik Arun Deo, Raymond‐Noël Kono, Chongyang Cai et al. · 2022 · 12 citations

Engineering, Mechanical Engineering, Reliability Engineering +16

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