E. Ghegin

Hybrid III–V/Silicon Technology for Laser Integration on a 200-mm Fully CMOS-Compatible Silicon Photonics Platform

Bertrand Szelag, Karim Hassan, Laetitia Adelmini et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2019 · 63 citations

Optical Materials, Engineering, Device Integration +19

28nm FDSOI CMOS Technology (FEOL and BEOL) Thermal Stability for 3D Sequential Integration: Yield and Reliability Analysis

C. Cavalcante, C. Fenouillet-Béranger, P. Batude et al. · 2020 · 27 citations

Engineering, Vlsi Design, Integrated Circuits +18

Cleaning of InGaAs and InP Layers for Nanoelectronics and Photonics Contact Technology Applications

Philippe Rodriguez, Laura Toselli, E. Ghegin et al. · ECS Transactions · 2015 · 24 citations · Full text

Engineering, Inp Layers, Vacuum Device +21

High performance CMOS FDSOI devices activated at low temperature

L. Pasini, P. Batude, J. Lacord et al. · 2016 · 14 citations

3D Ic Architecture, Electrical Engineering, Sige 27 +12

Formation of Ni3InGaAs phase in Ni/InGaAs contact at low temperature

C. Perrin, E. Ghegin, Seifeddine Zhiou et al. · Applied Physics Letters · 2016 · 13 citations

Materials Science, Aluminium Nitride, Engineering +15