ChungHsi J. Wu

Pattern collapse mitigation strategies for EUV lithography

Darı́o L. Goldfarb, Robert L. Bruce, James J. Bucchignano et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2012 · 33 citations

Materials Engineering, Materials Science, Pattern Deformation +15

Scattered light: the increasing problem for 193-nm exposure tools and beyond

Kafai Lai, ChungHsi J. Wu, Christopher J. Progler · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2001 · 28 citations

Engineering, Computational Illumination, Rayleigh Scattering +18

Performance of tri-layer process required for 22 nm and beyond

Yayi Wei, Martin Glodde, Hakeem Yusuff et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2011 · 23 citations

Materials Science, Electrical Engineering, Wafer Scale Processing +15

Investigation on the mechanism of the 193-nm resist linewidth reduction during the SEM measurement

ChungHsi J. Wu, Wu‐Song Huang, K. Rex Chen et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2001 · 22 citations

Engineering, Electron-beam Lithography, Measurement +22

Systematic studies on reactive ion etch-induced deformations of organic underlayers

Martin Glodde, Sebastian Engelmann, Michael Guillorn et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2011 · 19 citations

Engineering, Pattern Transfer, Opl Pattern +16