Statistics
Publications
3
Citations
78
H-Index
3
Active since
2005
L. Nebrich is an author at Fraunhofer Institute for Reliability and Microintegration specializing in 3d integrated circuits, engineering, and three-dimensional integration.
Publications per year
2005–2009
3
3
3D integration of image sensor SiP using TSV silicon interposer
M. Juergen Wolf, Kai Zoschke, Armin Klumpp et al. · 2009 · 21 citations
Engineering, Automotive Engineering, Systems Engineering +17
3D image sensor SiP with TSV silicon interposer
I. Limansyah, M. J. Wolf, Armin Klumpp et al. · 2009 · 20 citations · Full text
Engineering, Automotive Engineering, Systems Engineering +17
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