P. Philippe

Passive and heterogeneous integration towards a Si-based System-in-Package concept

F. Roozeboom, A.L.A.M. Kemmeren, J.F.C. Verhoeven et al. · Thin Solid Films · 2005 · 58 citations

Engineering, Device Integration, Advanced Packaging (Semiconductors) +8

Wavelength demultiplexer: using echelette gratings on silicon substrate

P. Philippe, S. Valette, O. Mata Méndez et al. · Applied Optics · 1985 · 56 citations

Micro-opto-mechanical vibration sensor integrated on silicon

E. Ollier, P. Philippe, C. Chabrol et al. · Journal of Lightwave Technology · 1999 · 27 citations

Photonic Sensor, Engineering, Mechanical Engineering +17

InGaAs photodiodes prepared by low-pressure MOCVD

P. Poulain, M. Razeghi, K. Kaźmierski et al. · Electronics Letters · 1985 · 22 citations

Photonics, Electrical Engineering, Photoelectric Sensor +10

CMOS compatible contacts and etching for InP-on-silicon active devices

L. Grenouillet, A.‐L. Bavencove, T. Dupont et al. · 2009 · 19 citations · Full text

Photonics, Electrical Engineering, Cmos Compatible Contacts +14