Majid Ahadi Dolatsara

Chiplet/Interposer Co-Design for Power Delivery Network Optimization in Heterogeneous 2.5-D ICs

Jinwoo Kim, Venkata Chaitanya Krishna Chekuri, Nael Mizanur Rahman et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 35 citations

Engineering, Vlsi Design, Energy Efficiency +20

Design Flow for Active Interposer-Based 2.5-D ICs and Study of RISC-V Architecture With Secure NoC

Heechun Park, Jinwoo Kim, Venkata Chaitanya Krishna Chekuri et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2020 · 24 citations

Engineering, Vlsi Design, Electronic Design Automation +19

Silicon vs. Organic Interposer: PPA and Reliability Tradeoffs in Heterogeneous 2.5D Chiplet Integration

Jinwoo Kim, Venkata Chaitanya Krishna Chekuri, Nael Mizanur Rahman et al. · 2020 · 23 citations

Interposer Substrate, Engineering, Vlsi Design +23

Worst-Case Eye Analysis of High-Speed Channels Based on Bayesian Optimization

Majid Ahadi Dolatsara, Jose A. Hejase, Dale Becker et al. · IEEE Transactions on Electromagnetic Compatibility · 2020 · 21 citations

Engineering, Computer Architecture, System-level Design +18

Inverse Design of Transmission Lines with Deep Learning

Kallol Roy, Majid Ahadi Dolatsara, Hakki Mert Torun et al. · 2019 · 14 citations

Artificial Intelligence, Convolutional Neural Network, Engineering +18