Jérémy Da Fonseca

Measurement of bonding energy in an anhydrous nitrogen atmosphere and its application to silicon direct bonding technology

Frank Fournel, Léonardo Continni, Christophe Morales et al. · Journal of Applied Physics · 2012 · 74 citations · Full text

Engineering, Chemistry, Silicon On Insulator +17

30 GHz heterogeneously integrated capacitive InP-on-Si Mach–Zehnder modulators

Torrey Thiessen, Philippe Grosse, Jérémy Da Fonseca et al. · Optics Express · 2019 · 26 citations · Full text

Optical Materials, Engineering, Optical Modulation +19

Back-Side-on-BOX Heterogeneously Integrated III-V-on-Silicon O-Band Distributed Feedback Lasers

Torrey Thiessen, Jason C. C. Mak, Jérémy Da Fonseca et al. · Journal of Lightwave Technology · 2020 · 26 citations

CMOS-Compatible Contacts to n-InP

E. Ghegin, Philippe Rodriguez, Mattia Pasquali et al. · IEEE Transactions on Electron Devices · 2017 · 13 citations

Materials Engineering, Materials Science, Cmos-compatible Contacts +15

Wafer bonding approaches for III-V on Si multi-junction solar cells

Laura Vauche, Elias Veinberg‐Vidal, Clément Weick et al. · 2017 IEEE 44th Photovoltaic Specialist Conference (PVSC) · 2017 · 10 citations

Materials Science, Electrical Engineering, Wafer Scale Processing +12