J.T. Moon

Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability

Hyoung-Joon Kim, Joo Yeon Lee, Kyung-Wook Paik et al. · IEEE Transactions on Components and Packaging Technologies · 2003 · 224 citations

Natural Sciences, Materials Engineering, Materials Science +17

The interface behavior of the Cu-Al bond system in high humidity conditions

S.H. Kim, J.W. Park, S.J. Hong et al. · 2010 · 36 citations

Natural Sciences, Materials Engineering, Materials Science +17

Predicting the Drop Performance of Solder Joints by Evaluating the Elastic Strain Energy from High-Speed Ball Pull Tests

Taehoon You, Yunsung Kim, Kim Jin-A et al. · Journal of Electronic Materials · 2009 · 31 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding

A. Pequegnat, H.J. Kim, M. Mayer et al. · Microelectronics Reliability · 2010 · 28 citations

Natural Sciences, Materials Engineering, Materials Science +12

Concurrent Optimization of Crescent Bond Pull Force and Tail Breaking Force in a Thermosonic Cu Wire Bonding Process

J. Lee, M. Mayer, Y. Zhou et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2009 · 17 citations

Natural Sciences, Manufacturing Engineering, Materials Engineering +11