Statistics
Publications
1
Citations
36
H-Index
1
Active since
2010
J.W. Park is an author specializing in bonding, corrosion mechanisms, and wire bonding.
Publications per year
2010–2010
1
1
The interface behavior of the Cu-Al bond system in high humidity conditions
S.H. Kim, J.W. Park, S.J. Hong et al. · 2010 · 36 citations
Natural Sciences, Materials Engineering, Materials Science +17
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