Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding

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Engineering, Electrical Engineering, Materials Science +12

A comparison of copper and gold wire bonding on integrated circuit devices

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Natural Sciences, Materials Engineering, Materials Science +15

Study of factors affecting the hardness of ball bonds in copper wire bonding

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Natural Sciences, Materials Engineering, Materials Science +14

Effects of process parameters on bondability in thermosonic copper ball bonding

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Natural Sciences, Materials Engineering, Materials Science +16

Study of copper free air ball in thermosonic copper ball bonding

Chunjin Hanga, Chunqing Wang, Mingda Shi et al. · 2006 · 29 citations

Natural Sciences, Electrical Engineering, Materials Engineering +13