F. Blaschta

Analysis of the impact of different additives during etch processes of dense and porous low-k with OES and QMS

Sven Zimmermann, Nicole Ahner, F. Blaschta et al. · Microelectronic Engineering · 2009 · 22 citations

Materials Science, Materials Engineering, Chemical Engineering +10

Optical properties of plasma polymer films (hexamethyldisiloxane)

R. Rochotzki, M. Arzt, F. Blaschta et al. · Thin Solid Films · 1993 · 18 citations

Materials Science, Optical Materials, Engineering +6

Thermal stability and gap-fill properties of spin-on MSQ low-k dielectrics

Nicole Ahner, Stefan E. Schulz, F. Blaschta et al. · Microelectronic Engineering · 2007 · 18 citations

Magnetism, Spintronics, Engineering +9

Influence of the additives argon, O2, C4F8, H2, N2 and CO on plasma conditions and process results during the etch of SiCOH in CF4 plasma

Sven Zimmermann, Nicole Ahner, F. Blaschta et al. · Microelectronic Engineering · 2010 · 16 citations

Chemical Engineering, Plasma Conditions, Plasma Combustion +6

Temperature and Composition Dependence of Exciton Peak Positions and Band Gap Energies of Zn1?xMgx(?0.19Se Epitaxial Films

R. P�ssler, F. Blaschta, E. Griebl et al. · physica status solidi (b) · 1997 · 16 citations

Engineering, Exciton Peak Positions, Temperature Dependence +18