Publication | Closed Access

Analysis of the impact of different additives during etch processes of dense and porous low-k with OES and QMS

Materials ScienceMaterials EngineeringChemical EngineeringPorous Low-kEngineeringPore StructureDifferent AdditivesEtch ProcessesPorosityTransport PhenomenaPlasma EtchingChemical KineticsPorous Body