Concepedia

Author

Zhiyi Xiao

Shanghai Fudan Microelectronics (China)

Also Known As

Zhiyi Xiao

26

Publications

235

Citations

10

H-Index

31

Concepts

All Affiliations

Shanghai Fudan Microelectronics (China)Chinese Academy of SciencesDalian University of TechnologyFudan University
ZX

About

Zhiyi Xiao is an author at Shanghai Fudan Microelectronics (China) specializing in engineering, microelectronics, and electronic packaging.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

7

7

147

2

Computer Engineering

3

3

80

3

Applied Physics

1

1

11

4

Computer Science

1

1

11

5

Data Science

1

1

11

Zhiyi Xiao

×

10

Publications

181

Citations

10

H-Index

YearCitations

Warpage Prediction and Optimization for Embedded Silicon Fan-Out Wafer-Level Packaging Based on an Extended Theoretical Model

Cheng Chen, Daquan Yu, Teng Wang,

IEEE Transactions on Components Packaging and Manufacturing Technology

2019

43

Embedded Si Fan Out: A Low Cost Wafer Level Packaging Technology without Molding and De-Bonding Processes

Daquan Yu, Zhenrui Huang, Zhiyi Xiao,

2017

35

Embedded Silicon Fan-Out (eSiFO): A Promising Wafer Level Packaging Technology for Multi-chip and 3D System Integration

Shuying Ma, Jiao Wang, Fengxia Zheng,

2018

23

Development and reliability study of 3D WLCSP for CMOS image sensor using vertical TSVs with 3:1 aspect ratio

Zhiyi Xiao, Mingjun Yao, Daquan Yu,

Microsystem Technologies

2017

14

Artificial Neural Network-Based Method for Identifying Under-Inflated Tire in Indirect TPMS

Xiaoping Wang, Zhiwen Chen, Wan Cao,

IEEE Access

2020

14

Development of 3D Thin WLCSP Using Vertical Via Last TSV Technology with Various Temporary Bonding Materials and Low Temperature PECVD Process

Zhiyi Xiao, Jun Fan, Yulong Ren,

2016

11

CIES: Cloud-based Intelligent Evaluation Service for video homework using CNN-LSTM network

Rui Song, Zhiyi Xiao, Jinjiao Lin,

Journal of Cloud Computing Advances Systems and Applications

2020

11

Process development of five- and six-side molded WLCSP

Shuying Ma, Teng Wang, Zhiyi Xiao,

2018

10

Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps

Mingjun Yao, Ning Zhao, Teng Wang,

IEEE Transactions on Components Packaging and Manufacturing Technology

2018

10

Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs

Mingjun Yao, Ning Zhao, Teng Wang,

Journal of Electronic Materials

2018

10

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