Zhiyi Xiao

Warpage Prediction and Optimization for Embedded Silicon Fan-Out Wafer-Level Packaging Based on an Extended Theoretical Model

Cheng Chen, Daquan Yu, Teng Wang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 43 citations

Fan-out Packages, Electrical Engineering, Chip-scale Package +14

Embedded Si Fan Out: A Low Cost Wafer Level Packaging Technology without Molding and De-Bonding Processes

Daquan Yu, Zhenrui Huang, Zhiyi Xiao et al. · 2017 · 35 citations

Advanced Packaging, Electrical Engineering, Chip-scale Package +13

Embedded Silicon Fan-Out (eSiFO): A Promising Wafer Level Packaging Technology for Multi-chip and 3D System Integration

Shuying Ma, Jiao Wang, Fengxia Zheng et al. · 2018 · 23 citations

Engineering, Computer Architecture, Integrated Circuits +19

Development and reliability study of 3D WLCSP for CMOS image sensor using vertical TSVs with 3:1 aspect ratio

Zhiyi Xiao, Mingjun Yao, Daquan Yu et al. · Microsystem Technologies · 2017 · 14 citations

Reliability Study, Time-of-flight Camera, Vertical Tsvs +2

Artificial Neural Network-Based Method for Identifying Under-Inflated Tire in Indirect TPMS

Xiaoping Wang, Zhiwen Chen, Wan Cao et al. · IEEE Access · 2020 · 14 citations · Full text

Soft Voting Mechanism, Engineering, Tire Pressure Monitoring +5