Concepedia
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Publications
1
Citations
23
H-Index
Active since
2018
Fengxia Zheng is an author specializing in electronic packaging, heterogeneous integration, and advanced packaging.
Top concepts
3D PrintingEngineeringMicroelectronicsMicrofabricationAdvanced PackagingSystem IntegrationIntegrated CircuitsComputer EngineeringElectronic PackagingComputer Architecture
Publications per year
2018–2018
Embedded Silicon Fan-Out (eSiFO): A Promising Wafer Level Packaging Technology for Multi-chip and 3D System Integration
Shuying Ma, Jiao Wang, Fengxia Zheng et al. · 2018 · 23 citations
Engineering, Computer Architecture, Integrated Circuits +19
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