Concepedia
Statistics
Publications
6
Citations
260
H-Index
Active since
2002
Affiliations
IMEC(Current)
KU Leuven
S. H. Brongersma is an author at IMEC specializing in materials science, metals, and natural sciences.
Publications per year
2002–2006
Growth mechanism and continuity of atomic layer deposited TiN films on thermal SiO2
A. Satta, Jörg Schuhmacher, Caroline M. Whelan et al. · Journal of Applied Physics · 2002 · 90 citations
Natural Sciences, Materials Engineering, Materials Science +17
Surface and grain boundary scattering studied in beveled polycrystalline thin copper films
W. Zhang, S. H. Brongersma, Trudo Clarysse et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2004 · 53 citations
Natural Sciences, Materials Science, Physics +16
Geometry Effect on Impurity Incorporation and Grain Growth in Narrow Copper Lines
W. Zhang, S. H. Brongersma, N. Heylen et al. · Journal of The Electrochemical Society · 2005 · 52 citations
Engineering, Materials Engineering, Materials Science +17
Impact of line edge roughness on copper interconnects
Leonardus H. A. Leunissen, W. Zhang, Wen‐Wei Wu et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2006 · 30 citations
Engineering, Electrical Engineering, Microelectronics +16
Impurity Incorporation during Copper Electrodeposition in the Curvature-Enhanced Accelerator Coverage Regime
W. Zhang, S. H. Brongersma, Thierry Conard et al. · Electrochemical and Solid-State Letters · 2005 · 22 citations
Natural Sciences, Materials Engineering, Materials Science +16
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