B. Dunne

Via first approach optimisation for Through Silicon Via applications

C. Laviron, B. Dunne, V. Lapras et al. · 2009 · 36 citations

Engineering, Vlsi Design, Computer Architecture +18

Through Silicon Vias Technology for CMOS Image Sensors Packaging: Presentation of Technology and Electrical Results

David Henry, Jean Charbonnier, P. Chausse et al. · 2008 · 33 citations

Electrical Resistance, Electrical Results, Engineering +18

Via First Technology Development Based on High Aspect Ratio Trenches Filled with Doped Polysilicon

David Henry, Xavier Baillin, V. Lapras et al. · 2007 · 32 citations

Materials Engineering, 3D Ic Architecture, Electrical Engineering +13

Mid-process through silicon vias technology using tungsten metallization: Process optimazation and electrical results

G. Parès, S. Minoret, J.-F. Lugand et al. · 2009 · 12 citations

Engineering, Mechanical Engineering, Silicon On Insulator +21

High Aspect Ratio Vias First for Advanced Packaging

David Henry, Xavier Baillin, V. Lapras et al. · 2007 · 10 citations

Different Vias Geometries, Engineering, Computer-aided Design +16