M. Pellat

On the potential of Resonant Ultrasound Spectroscopy applied to the non-destructive characterization of the density of (LPBF) additively manufactured materials

Florian Le Bourdais, Jitendra Singh Rathore, Camille Ly et al. · Additive manufacturing · 2022 · 23 citations · Full text

Study of a silicon/glass bonded structure with a UV-curable adhesive for temporary bonding applications

Pierre Montméat, T. Enot, M. De Marco Dutra et al. · Microelectronic Engineering · 2017 · 21 citations

Materials Science, Uv-curable Adhesive, Engineering +7

Innovative wafer-level encapsulation & underfill material for silicon interposer application

C. Ferrandon, A. Jouve, S. Joblot et al. · 2013 · 19 citations

Challenges and Progress in Germanium-on-Insulator Materials and Device Development towards ULSI Integration

E. Augendre, Loïc Sanchez, L. Benaissa et al. · ECS Transactions · 2009 · 18 citations

Engineering, Silicon On Insulator, Semiconductor Device +16

Hermetic wafer-level packaging development for RF MEMS switch

C. Ferrandon, F. Greco, E. Lagoutte et al. · 2010 · 16 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +17