C. Ferrandon

Silicon interposer: A versatile platform towards full-3D integration of wireless systems at millimeter-wave frequencies

O. El Bouayadi, Laurent Dussopt, Yann Lamy et al. · 2015 · 38 citations

Engineering, Device Integration, Microwave Transmission +20

Evaluation of 3D interconnect routing and stacking strategy to optimize high speed signal transmission for memory on logic

J. Roullard, A. Farcy, S. Capraro et al. · 2012 · 24 citations

Hardware Security, 3D Ic Architecture, Electrical Engineering +15

Copper pillar interconnect capability for mmwave applications in 3D integration technology

S. Joblot, P. Bar, H. Sibuet et al. · Microelectronic Engineering · 2013 · 22 citations

Copper Pillar, 3D Ic Architecture, Electrical Engineering +13

Innovative wafer-level encapsulation & underfill material for silicon interposer application

C. Ferrandon, A. Jouve, S. Joblot et al. · 2013 · 19 citations

A compact 3D silicon interposer package with integrated antenna for 60GHz wireless applications

Yann Lamy, Laurent Dussopt, O. El Bouayadi et al. · 2013 · 19 citations

Engineering, Microwave Transmission, Integrated Circuits +18