Copper pillar interconnect capability for mmwave applications in 3D integration technology - Concepedia

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Copper pillar interconnect capability for mmwave applications in 3D integration technology

22

Citations

9

References

2013

Year

S. Joblot, P. Bar, H. Sibuet, C. Ferrandon, Bruno Reig, S. Jan, C. Arnaud, Yann Lamy, P. Coudrain, R. Coffy,

Microelectronic Engineering

Copper Pillar3D Ic ArchitectureElectrical EngineeringMillimeter Wave TechnologyEngineeringDevice IntegrationAdvanced Packaging (Semiconductors)Applied Physics3D IntegrationMicroelectronicsIntegration TechnologyOptoelectronicsMmwave Applications3D PrintingInterconnect (Integrated Circuits)Electromagnetic Compatibility

References

	Year	Citations

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