Copper pillar interconnect capability for mmwave applications in 3D integration technology

Low-loss CPW lines on surface stabilized high-resistivity silicon

H.S. Gamble, B.M. Armstrong, S.J.N. Mitchell et al. · IEEE Microwave and Guided Wave Letters · 1999 · 161 citations

Engineering, Electrical Engineering, Materials Science +17

Theory and measurements of flip-chip interconnects for frequencies up to 100 GHz

Andreas Vargas Jentzsch, W. Heinrich · IEEE Transactions on Microwave Theory and Techniques · 2001 · 146 citations

Engineering, Electrical Engineering, Microelectronics +16

Attenuation mechanisms of aluminum millimeter-wave coplanar waveguides on silicon

C. Schöllhorn, Weiwei Zhao, M. Morschbach et al. · IEEE Transactions on Electron Devices · 2003 · 103 citations

Engineering, Electrical Engineering, Materials Science +17

Low-loss CPW on low-resistivity Si substrates with a micromachined polyimide interface layer for RFIC interconnects

George E. Ponchak, A. Margomenos, L.P.B. Katehi · IEEE Transactions on Microwave Theory and Techniques · 2001 · 100 citations

Engineering, Electrical Engineering, Materials Science +16

TSV Technology for Millimeter-Wave and Terahertz Design and Applications

Sanming Hu, Lei Wang, Yong‐Zhong Xiong et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2010 · 71 citations

Engineering, Electrical Engineering, Antennas +16