R. Coffy

HDI organic technology integrating built-in antennas dedicated to 60 GHz SiP solution

Romain Pilard, Diane Titz, Frédéric Gianesello et al. · 2012 · 39 citations

Engineering, Electrical Engineering, Antennas +16

Copper pillar interconnect capability for mmwave applications in 3D integration technology

S. Joblot, P. Bar, H. Sibuet et al. · Microelectronic Engineering · 2013 · 22 citations

Engineering, Electrical Engineering, Materials Science +16

High performance RF inductors integrated in advanced Fan-Out wafer level packaging technology

C. Durand, Frédéric Gianesello, Romain Pilard et al. · 2012 · 12 citations

Engineering, Electrical Engineering, Microelectronics +16

Reliability study for large silicon interposers report on board

C. Ferrandon, S. Joblot, Yann Lamy et al. · 2013 · 11 citations

Engineering, Computer Engineering, Electrical Engineering +17