Cobalt Polishing with Reduced Galvanic Corrosion at Copper/Cobalt Interface Using Hydrogen Peroxide as an Oxidizer in Colloidal Silica-Based Slurries

B. Peethala, H. P. Amanapu, Uma Rames Krishna Lagudu, +1

Journal of The Electrochemical Society

EngineeringChemistryMineral ProcessingColloidal Silica-based SlurryCorrosion Inhibition +15

Controlling the Galvanic Corrosion of Copper during Chemical Mechanical Planarization of Ruthenium Barrier Films

B. Peethala, D. Roy, S. V. Babu

Electrochemical and Solid-State Letters

Materials ScienceMaterials EngineeringChemical EngineeringAscorbic AcidCmp Dispersions +11

Citric Acid as a Complexing Agent in Chemical Mechanical Polishing Slurries for Cobalt Films for Interconnect Applications

R. Popuri, K. V. Sagi, S. R. Alety, +4

ECS Journal of Solid State Science and Technology

Cobalt FilmsEngineeringChemistryColloidal Silica-based SlurryComplexing Agent +15

Future on-chip interconnect metallization and electromigration

Chunhua Hu, James J. Kelly, Huai Huang, +21

Materials ScienceMaterials EngineeringElectrical EngineeringElectromigration TechniqueCu Liner +13

Ruthenium Polishing Using Potassium Periodate as the Oxidizer and Silica Abrasives

B. Peethala, S. V. Babu

Journal of The Electrochemical Society

EngineeringChemistryDesulfurizationMineral ProcessingAbrasive Process +19

Role of Different Additives on Silicon Dioxide Film Removal Rate during Chemical Mechanical Polishing Using Ceria-Based Dispersions

P.R. Veera Dandu, B. Peethala, S. V. Babu

Journal of The Electrochemical Society

EngineeringDifferent AdditivesMechanical EngineeringSeveral AdditivesChemistry +14

Tungsten and cobalt metallization: A material study for MOL local interconnects

V. Kamineni, M. Raymond, S. Siddiqui, +21

Mol Local InterconnectsEngineeringCvd W-based MetallizationWafer Scale ProcessingAdvanced Packaging (Semiconductors) +19

Experimental study of nanoscale Co damascene BEOL interconnect structures

James J. Kelly, Jinai Chen, Huai Huang, +14

EngineeringNm Node DimensionsMaterial InnovationCo Line ResistanceInterconnect (Integrated Circuits) +14

Role of hydrogen bonding on the adsorption of several amino acids on SiO2 and Si3N4 and selective polishing of these materials using ceria dispersions

Naresh K. Penta, B. Peethala, H. P. Amanapu, +2

Colloids and Surfaces A Physicochemical and Engineering Aspects

Materials ScienceMolecular SieveChemical EngineeringEngineeringMolecular Sieving +8

Electromigration and resistivity in on-chip Cu, Co and Ru damascene nanowires

Chunhua Hu, James J. Kelly, J. H-C Chen, +19

EngineeringInterconnect (Integrated Circuits)NanoelectronicsElectronic PackagingCo Cap +16