B. Peethala

Cobalt Polishing with Reduced Galvanic Corrosion at Copper/Cobalt Interface Using Hydrogen Peroxide as an Oxidizer in Colloidal Silica-Based Slurries

B. Peethala, H. P. Amanapu, Uma Rames Krishna Lagudu et al. · Journal of The Electrochemical Society · 2012 · 87 citations

Engineering, Chemistry, Mineral Processing +17

Controlling the Galvanic Corrosion of Copper during Chemical Mechanical Planarization of Ruthenium Barrier Films

B. Peethala, D. Roy, S. V. Babu · Electrochemical and Solid-State Letters · 2011 · 81 citations

Materials Science, Materials Engineering, Chemical Engineering +13

Citric Acid as a Complexing Agent in Chemical Mechanical Polishing Slurries for Cobalt Films for Interconnect Applications

R. Popuri, K. V. Sagi, S. R. Alety et al. · ECS Journal of Solid State Science and Technology · 2017 · 73 citations · Full text

Cobalt Films, Engineering, Chemistry +17

Future on-chip interconnect metallization and electromigration

Chunhua Hu, James J. Kelly, Huai Huang et al. · 2018 · 69 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Ruthenium Polishing Using Potassium Periodate as the Oxidizer and Silica Abrasives

B. Peethala, S. V. Babu · Journal of The Electrochemical Society · 2011 · 67 citations

Engineering, Chemistry, Desulfurization +21