Concepedia

Scott Mokler

SM

3

Publications

82

Citations

3

H-Index

2018

Active since

Affiliations

Intel (United States)(Current)

Microsoft (United States)

Soochow University

Indium Corporation (United States)

Lenovo (China)

Scott Mokler is an author at Intel (United States) specializing in electronic packaging, materials science, and engineering.

Top concepts

Publications per year

2018–2018

3

Publications

3

Low Temperature Solder - A Breakthrough Technology for Surface Mounted Devices

Shubhada Sahasrabudhe, Scott Mokler, M. Renavikar et al. · 2018 · 46 citations

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iNEMI project on process development of BISN-based low temperature solder pastes — Part II: Characterization of mixed alloy BGA solder joints

Haley Fu, Raiyo Aspandiar, Jimmy Chen et al. · 2018 · 23 citations

, , +13

iNEMI project on process development of BiSn-based low temperature solder pastes: Part III: Mechanical shock tests on POP BGA assemblies

Haley Fu, Jagadeesh Radhakrishnan, Morgana Ribas et al. · 2018 · 13 citations

, , +17

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