Concepedia

M. Renavikar

MR

10

Publications

309

Citations

10

H-Index

2006

Active since

Affiliations

Intel (United States)(Current)

Washington State University

University of Colorado Boulder

Naval Postgraduate School

M. Renavikar is an author at Intel (United States) specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMaterials EngineeringMechanical EngineeringHeat TransferMicrostructureThermal EngineeringElectrical EngineeringCorrosion

Publications per year

2006–2018

10

Publications

10

Microstructure and mechanical behavior of novel rare earth-containing Pb-Free solders

Mariusz Dudek, R. Sidhu, Nikhilesh Chawla et al. · Journal of Electronic Materials · 2006 · 71 citations

Materials Science, Materials Engineering, Engineering +6

Low Temperature Solder - A Breakthrough Technology for Surface Mounted Devices

Shubhada Sahasrabudhe, Scott Mokler, M. Renavikar et al. · 2018 · 46 citations

Engineering, Mechanical Engineering, Key Technical Modulators +17

Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates: I. Effects of Loading and Processing Conditions

Zhe Huang, Praveen Kumar, I. Dutta et al. · Journal of Electronic Materials · 2011 · 38 citations

Materials Science, Materials Engineering, Processing Conditions +11

Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Material Applications

I. Dutta, Rishi Raj, Praveen Kumar et al. · Journal of Electronic Materials · 2009 · 38 citations

Materials Engineering, Materials Science, Electrical Engineering +9

Materials Technology for Environmentally Green Micro Electronic Packagin

M. Renavikar · Intel Technology Journal · 2008 · 30 citations

Green Packaging, Engineering, Integrated Circuits +19

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