Publication | Closed Access
Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates: I. Effects of Loading and Processing Conditions
38
Citations
30
References
2011
Year
Materials ScienceMaterials EngineeringProcessing ConditionsEngineeringCorrosionMechanical EngineeringApplied PhysicsMetallurgical InteractionCu SubstratesSolid MechanicsElectronic PackagingSn-ag-cu Solder JointsMechanics Of MaterialsMicrostructure
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