G. Druais

14nm FDSOI technology for high speed and energy efficient applications

O. Weber, E. Josse, F. Andrieu et al. · 2014 · 89 citations

Low-power Electronics, Electrical Engineering, Engineering +9

New insights on bottom layer thermal stability and laser annealing promises for high performance 3D VLSI

C. Fenouillet-Béranger, B. Mathieu, B. Prévitali et al. · 2014 · 56 citations

Engineering, Vlsi Design, New Insights +20

Development and characterisation of a 3D technology including TSV and Cu pillars for high frequency applications

Jean Charbonnier, R. Hida, David Henry et al. · 2010 · 29 citations

Engineering, Computer-aided Design, Packaging Technologies +16

High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed

G. Druais, Gabriela Dilliway, Pamela R. Fischer et al. · Microelectronic Engineering · 2008 · 25 citations

Materials Engineering, Materials Science, Engineering +7

Technology-circuit convergence for full-SOC platform in 28 nm and beyond

F. Arnaud, Steve Colquhoun, A.L. Mareau et al. · 2011 · 13 citations

Hardware Security, System On Chip, Electrical Engineering +15