Jeff Bielefeld

A 90 nm logic technology featuring 50 nm strained silicon channel transistors, 7 layers of Cu interconnects, low k ILD, and 1 μm/sup 2/ SRAM cell

Scott E. Thompson, N. Anand, M Armstrong et al. · 2003 · 243 citations

Engineering, Computer Engineering, Electrical Engineering +17

Fourier transform infrared spectroscopy investigation of chemical bonding in low-k a-SiC:H thin films

Sean W. King, Marc French, Jeff Bielefeld et al. · Journal of Non-Crystalline Solids · 2011 · 107 citations

Natural Sciences, Materials Science, Physics +17

Influence of network bond percolation on the thermal, mechanical, electrical and optical properties of high and low-k a-SiC:H thin films

Sean W. King, Jeff Bielefeld, Guanghai Xu et al. · Journal of Non-Crystalline Solids · 2013 · 83 citations

Natural Sciences, Materials Engineering, Materials Science +17

Film Property Requirements for Hermetic Low-k a-SiO_xC_yN_z:H Dielectric Barriers

Sean W. King, Danya Jacob, D. Vanleuven et al. · ECS Journal of Solid State Science and Technology · 2012 · 59 citations

Natural Sciences, Materials Engineering, Materials Science +17

Mass and bond density measurements for PECVD a-SiCx:H thin films using Fourier transform-infrared spectroscopy

Sean W. King, Jeff Bielefeld, Marc French et al. · Journal of Non-Crystalline Solids · 2011 · 54 citations

Natural Sciences, Materials Engineering, Materials Science +16