S. Nathapong is an author at STATS ChipPAC (Singapore) specializing in mechanical engineering, microfabrication, and electronic packaging.
Top concepts
3D PrintingEngineeringMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingMaterials EngineeringMechanical Engineering3D IntegrationApplied Physics
Publications per year
2008–2010
2
2
Temporary Bonding of Wafer to Carrier for 3D-Wafer Level Packaging
Mark Huang Shuangwu, D. Pang, S. Nathapong et al. · 2008 · 25 citations
Engineering, Mechanical Engineering, Wafer Scale Processing +18
3D interconnection process development and integration with low stress TSV
Tze‐Kwang Chua, Soon Wee Ho, H. Y. Li et al. · 2010 · 19 citations
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