Statistics
Publications
1
Citations
26
H-Index
1
Active since
2008
Affiliations
STATS ChipPAC (Singapore)(Current)
Mark Huang Shuangwu is an author at STATS ChipPAC (Singapore) specializing in semiconductor devices, silicon materials, and materials engineering.
Publications per year
2008–2008
1
1
Temporary Bonding of Wafer to Carrier for 3D-Wafer Level Packaging
Mark Huang Shuangwu, D. Pang, S. Nathapong et al. · 2008 · 26 citations
Engineering, Electrical Engineering, Materials Engineering +17
1–1 of 1