Bit Cost Scalable Technology with Punch and Plug Process for Ultra High Density Flash Memory

Hidetake Tanaka, M. Kido, K. Yahashi, +10

Hardware SecurityNon-volatile MemoryElectrical EngineeringEngineeringFlexible Electronics +13

Bipolar resistive switching in polycrystalline TiO2 films

K. Tsunoda, Y. Fukuzumi, John R. Jameson, +3

Applied Physics Letters

Materials ScienceTio2 MatrixElectrical EngineeringSolid-state IonicEngineering +12

Optimal Integration and Characteristics of Vertical Array Devices for Ultra-High Density, Bit-Cost Scalable Flash Memory

Y. Fukuzumi, Ryota Katsumata, Masaru Kito, +8

Non-volatile MemoryEngineeringEmerging Memory TechnologyComputer ArchitectureUltra-high Density +17

Pipe-shaped BiCS flash memory with 16 stacked layers and multi-level-cell operation for ultra high density storage devices

Ryota Katsumata, Masaru Kito, Y. Fukuzumi, +12

Symposium on VLSI Technology

Non-volatile MemoryElectrical EngineeringEngineeringP-bics Flash TechnologyMicrofabrication +12

Field-programmable rectification in rutile TiO2 crystals

John R. Jameson, Y. Fukuzumi, Zheng Wang, +4

Applied Physics Letters

Materials ScienceEngineeringCrystal MaterialNanotechnologyCrystal Growth Technology +9

Optimal device structure for Pipe-shaped BiCS Flash memory for ultra high density storage device with excellent performance and reliability

Megumi Ishiduki, Y. Fukuzumi, Ryota Katsumata, +14

Non-volatile MemoryElectrical EngineeringStorage SystemsEngineeringExcellent Performance +10

Disturbless flash memory due to high boost efficiency on BiCS structure and optimal memory film stack for ultra high density storage device

Yosuke Komori, M. Kido, Masaru Kito, +7

Non-volatile MemoryElectrical EngineeringErase OperationEngineeringBics Flash Memory +12

FBC (Floating Body Cell) for embedded DRAM on SOI

K. Inoh, T. Shino, Hisao Yamada, +11

Hardware SecurityNon-volatile MemoryElectrical EngineeringCell TransistorEngineering +9

3D NAND Scaling in the next decade

Russ Meyer, Y. Fukuzumi, Yingda Dong

2022 International Electron Devices Meeting (IEDM)

EngineeringComputer ArchitectureComputer-aided DesignWl Pitch ScalingPhysical Design (Electronics) +15

Multi-stacked 1G cell/layer Pipe-shaped BiCS Flash Memory

Takashi Maeda, Kiyotaro Itagaki, Tomoo Hishida, +12

Non-volatile MemoryElectrical EngineeringEngineeringNew Erase OperationFlash Memory +8