A. Schmidt

A modular 0.13 μm bulk CMOS technology for high performance and low power applications

L.-K. Han, S. Biesemans, J. Heidenreich et al. · 2002 · 27 citations

Low Power Applications, Engineering, Vlsi Design +17

A universal dual band LNA implementation in SiGe technology for wireless applications

A. Schmidt, S. Catala · IEEE Journal of Solid-State Circuits · 2001 · 26 citations

Electrical Engineering, Engineering, Rf Semiconductor +14

0.18 um modular triple self-aligned embedded split-gate flash memory

Rebecca D. Mih, James A. Harrington, K. Houlihan et al. · 2002 · 23 citations

Hardware Security, Non-volatile Memory, Electrical Engineering +13

High Temperature Characterization up to 450 °C of MOSFETs and basic circuits realized in a Silicon-on-Insulator (SOI) CMOS-Technology

K. Grella, S. Dreiner, A. Schmidt et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2012 · 15 citations

Materials Science, Electrical Engineering, High Temperature Characterization +12

Silicon Photomultipliers With Area Up to 9 mm² in a 0.35-$\mu$ m CMOS Process

Xiao Liang, N. d’Ascenzo, W. Brockherde et al. · IEEE Journal of the Electron Devices Society · 2019 · 14 citations · Full text