Statistics
Publications
7
Citations
232
H-Index
7
Active since
2008
Y. Ostrovski is an author at IBM (United States) specializing in materials science, natural sciences, and electronic materials.
Publications per year
2008–2018
7
7
Future on-chip interconnect metallization and electromigration
Chunhua Hu, James J. Kelly, Huai Huang et al. · 2018 · 70 citations
Mechanisms of Electromigration Damage in Cu Interconnects
Chunhua Hu, L. Gignac, G. Lian et al. · 2018 · 26 citations
Natural Sciences, Electrical Engineering, Materials Science +14
E. Todd Ryan, S. M. Gates, S. A. Cohen et al. · Journal of Applied Physics · 2014 · 14 citations
Natural Sciences, Materials Engineering, Materials Science +17
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