T. Feudel

Integration and optimization of embedded-sige, compressive and tensile stressed liner films, and stress memorization in advanced SOI CMOS technologies

L.T. Su, John Pellerin, Shih-Fen Huang et al. · 2005 · 63 citations

Engineering, Vlsi Design, Silicon On Insulator +16

A technology oriented model for transient diffusion and activation of boron in silicon

A. Höfler, T. Feudel, N. Strecker et al. · Journal of Applied Physics · 1995 · 29 citations

Semiconductor Technology, Defect Tolerance, Electrical Engineering +13

Modeling of defect–phosphorus pair diffusion in phosphorus–implanted silicon

H.U. Jäger, T. Feudel, Steffen Ulbricht · physica status solidi (a) · 1989 · 14 citations

Materials Science, Engineering, Defect–phosphorus Pair Diffusion +13

Review on Process-Induced Strain Techniques for Advanced Logic Technologies

Maciej Wiatr, T. Feudel, A. Wei et al. · 2007 · 10 citations

Process Integration Issues with Spike, Flash and Laser Anneal Implementation for 90 and 65 NM Technologies

T. Feudel, L. Herrmann, M. Herden et al. · 2006 · 10 citations