H. Boutry

Enabling technologies for 3D integration: From packaging miniaturization to advanced stacked ICs

N. Sillon, A. Astier, H. Boutry et al. · 2008 · 55 citations

Engineering, Computer Engineering, Electrical Engineering +17

Anti phase boundary free GaSb layer grown on 300 mm (001)-Si substrate by metal organic chemical vapor deposition

Tiphaine Cerba, M. Martin, J. Moeyaert et al. · Thin Solid Films · 2017 · 24 citations

Natural Sciences, Materials Engineering, Materials Science +14

First demonstration of 3D SRAM through 3D monolithic integration of InGaAs n-FinFETs on FDSOI Si CMOS with inter-layer contacts

Veeresh Deshpande, H. Hahn, Eileen O’Connor et al. · 2017 · 20 citations

Engineering, Computer Engineering, Electrical Engineering +17

System-on-Wafer: 2-D and 3-D Technologies for Heterogeneous Systems

Jean-Charles Souriau, N. Sillon, J.J. Brun et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 18 citations

Engineering, Manufacturing Engineering, Systems Engineering +17

Demonstration of 3-D SRAM Cell by 3-D Monolithic Integration of InGaAs n-FinFETs on FDSOI CMOS With Interlayer Contacts

Veeresh Deshpande, H. Hahn, Eileen O’Connor et al. · IEEE Transactions on Electron Devices · 2017 · 15 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17