Statistics
Publications
14
Citations
599
H-Index
13
Active since
1935
J.J. Brun is an author at CEA Grenoble specializing in chip packaging, engineering, and integrated circuit fabrication.
Publications per year
1935–2020
14
14
Integration of a temporary carrier in a TSV process flow
Jean Charbonnier, S. Chéramy, David Henry et al. · 2009 · 61 citations
Facilitating Ultrathin Wafer Handling for TSV Processing
A. Jouve, Shelly Fowler, Mark Privett et al. · 2008 · 42 citations
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