E. Travis

Thin film properties of low-pressure chemical vapor deposition TiN barrier for ultra-large-scale integration applications

Rama I. Hegde, R. Fiordalice, E. Travis et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1993 · 83 citations

Engineering, Oxidation Resistance, Thin Film Process Technology +20

Manufacturing aspects of low pressure chemical-vapor-deposited TiN barrier layers

E. Travis, R. Fiordalice · Thin Solid Films · 1993 · 33 citations

Materials Engineering, Materials Science, Engineering +5

Auger electron spectroscopy and Rutherford backscattering characterization of TiN<i>x</i>/TiSi<i>y</i> contact barrier metallization

M. Kottke, R. B. Gregory, F. Pintchovski et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1991 · 22 citations

Materials Science, Surface Characterization, Engineering +15

Application of on-chip MIM decoupling capacitor for 90nm SOI microprocessor

D. Roberts, Walter Johnstone, H. Sanchez et al. · 2006 · 17 citations

Low-power Electronics, System On Chip, Electrical Engineering +12

A two-dimensional low pass filter model for die-level topography variation resulting from chemical mechanical polishing of ILD films

Tat-Kwan Yu, S. Chheda, Jaehyoung Ko et al. · 2003 · 15 citations

Die-level Topography Variation, Engineering, Inverse Fft +19