S. V. S. B. Janjam

Comparison of dicarboxylic acids as complexing agents for abrasive-free chemical mechanical planarization of copper

Suresh Ramakrishnan, S. V. S. B. Janjam, Udaya B. Patri et al. · Microelectronic Engineering · 2006 · 59 citations

Engineering, Materials Engineering, Materials Science +9

Tartaric Acid as a Complexing Agent for Selective Removal of Tantalum and Copper in CMP

S. V. S. B. Janjam, Shivaji Peddeti, D. Roy et al. · Electrochemical and Solid-State Letters · 2008 · 42 citations

Engineering, Materials Engineering, Materials Science +13

Electrochemical investigation of surface reactions for chemically promoted chemical mechanical polishing of TaN in tartaric acid solutions

S. V. S. B. Janjam, B. Peethala, J. P. Zheng et al. · Materials Chemistry and Physics · 2010 · 20 citations

Natural Sciences, Chemistry, Materials Science +17

Chemical Mechanical Planarization of TaN Wafers Using Oxalic and Tartaric Acid Based Slurries

S. V. S. B. Janjam, B. Peethala, D. Roy et al. · Electrochemical and Solid-State Letters · 2009 · 20 citations

Engineering, Materials Engineering, Materials Science +16

Oxalic-Acid-Based Slurries with Tunable Selectivity for Copper and Tantalum Removal in CMP

S. V. S. B. Janjam, C. Surisetty, S. Pandija et al. · Electrochemical and Solid-State Letters · 2008 · 19 citations

Engineering, Chemical Engineering, Materials Science +14