S. Pandija

Chemical mechanical planarization of copper using abrasive-free solutions of oxalic acid and hydrogen peroxide

S. Pandija, D. Roy, S. V. Babu · Materials Chemistry and Physics · 2006 · 58 citations

Materials Science, Extractive Metallurgy, Chemical Engineering +10

Achievement of high planarization efficiency in CMP of copper at a reduced down pressure

S. Pandija, D. Roy, S. V. Babu · Microelectronic Engineering · 2008 · 56 citations

Materials Science, Electrical Engineering, Engineering +1

Oxalic Acid as a Complexing Agent in CMP Slurries for Copper

Venkata R. K. Gorantla, Ashok K. Babel, S. Pandija et al. · Electrochemical and Solid-State Letters · 2005 · 54 citations

Engineering, Cmp Slurries, Green Chemistry +16

Chemical effects in chemical mechanical planarization of TaN: investigation of surface reactions in a peroxide-based alkaline slurry using Fourier transform impedance spectroscopy

Venkata R. K. Gorantla, Samuel B. Emery, S. Pandija et al. · Materials Letters · 2004 · 24 citations

Materials Science, Chemical Engineering, Engineering +13

Oxalic-Acid-Based Slurries with Tunable Selectivity for Copper and Tantalum Removal in CMP

S. V. S. B. Janjam, C. Surisetty, S. Pandija et al. · Electrochemical and Solid-State Letters · 2008 · 19 citations

Engineering, Material Innovation, Cu Planarization +18