Udaya B. Patri

Comparison of dicarboxylic acids as complexing agents for abrasive-free chemical mechanical planarization of copper

Suresh Ramakrishnan, S. V. S. B. Janjam, Udaya B. Patri et al. · Microelectronic Engineering · 2006 · 59 citations

Engineering, Materials Engineering, Materials Science +9

Role of the Functional Groups of Complexing Agents in Copper Slurries

Udaya B. Patri, Serdar Aksu, S. V. Babu · Journal of The Electrochemical Society · 2006 · 53 citations

Natural Sciences, Chemical Engineering, Chemistry +16

Utility of dodecyl sulfate surfactants as dissolution inhibitors in chemical mechanical planarization of copper

Yeh-Sun Hong, Udaya B. Patri, Suresh Ramakrishnan et al. · Journal of materials research/Pratt's guide to venture capital sources · 2005 · 50 citations

Natural Sciences, Chemistry, Materials Science +14

Role of Molecular Structure of Complexing/Chelating Agents in Copper CMP Slurries

Udaya B. Patri, S. Pandija, S. V. Babu · MRS Proceedings · 2005 · 13 citations

Natural Sciences, Chemical Engineering, Chemistry +9

Chemical-mechanical Polishing of Copper Using Molybdenum Dioxide Slurry

Sharath Hegde, Udaya B. Patri, S. V. Babu · Journal of materials research/Pratt's guide to venture capital sources · 2005 · 11 citations

Engineering, Materials Engineering, Materials Science +13