K. Makabe

A New TDDB Degradation Model Based on Cu Ion Drift in Cu Interconnect Dielectrics

N. Suzumura, S. Yamamoto, Daisuke Kodama et al. · 2006 · 107 citations

Engineering, Electrical Engineering, Materials Science +17

Cu-ion-migration phenomena and its influence on TDDB lifetime in Cu metallization

J. Noguchi, Natsuko Miura, M. Kubo et al. · 2003 · 39 citations

Engineering, Electrical Engineering, Materials Science +17

The Analysis of the Defective Cells Induced by COP in a 0.3-micron-technology Node DRAM

M. Muranaka, K. Makabe, Masashi Miura et al. · Japanese Journal of Applied Physics · 1998 · 11 citations

Engineering, Computer Engineering, Electrical Engineering +14

Influence of Cu-Ion Migration and Fine-Line Effect on Time-Dependent Dielectric Breakdown Lifetime of Cu Interconnects

J. Noguchi, Maki Kubo, Ruriko Tsuneda et al. · Japanese Journal of Applied Physics · 2005 · 10 citations

Natural Sciences, Electrical Engineering, Materials Science +17

NBT-induced hot carrier (HC) effect: positive feedback mechanism in p-MOSFET's degradation

H. Aono, Eiichi Murakami, Kikuo Okuyama et al. · 2003 · 10 citations

Engineering, Electrical Engineering, Electronic Materials +16