Concepedia

Vamsi Devarapalli

VD

Statistics

Publications

8

Citations

213

H-Index

8

Active since

2004

Affiliations

IBM (United States)(Current)

Clarkson University

Materials Processing (United States)

Vamsi Devarapalli is an author at IBM (United States) specializing in materials science, materials engineering, and engineering.

ORCID

Publications per year

2004–2015

8

Publications

8

Synergistic Roles of Dodecyl Sulfate and Benzotriazole in Enhancing the Efficiency of CMP of Copper

Yeh-Sun Hong, Vamsi Devarapalli, D. Roy et al. · Journal of The Electrochemical Society · 2007 · 78 citations

, , +17

Reverse selectivity – High silicon nitride and low silicon dioxide removal rates using ceria abrasive-based dispersions

P.R. Veera Dandu, Vamsi Devarapalli, S. V. Babu · Journal of Colloid and Interface Science · 2010 · 38 citations

, , +8

Post Cu CMP Cleaning of Polyurethane Pad Debris

Wei‐Tsu Tseng, Elliott Rill, Benjamin Backes et al. · ECS Journal of Solid State Science and Technology · 2013 · 20 citations

, , +11

Post Copper CMP Hybrid Clean Process for Advanced BEOL Technology

Wei‐Tsu Tseng, Vamsi Devarapalli, James Steffes et al. · IEEE Transactions on Semiconductor Manufacturing · 2013 · 18 citations

, , +17

Post Cu CMP cleaning process evaluation for 32nm and 22nm technology nodes

Wei‐Tsu Tseng, D. Canaperi, Anthony J. Ticknor et al. · 2012 · 18 citations

, , +14

1–5 of 8