P.R. Veera Dandu

Role of Different Additives on Silicon Dioxide Film Removal Rate during Chemical Mechanical Polishing Using Ceria-Based Dispersions

P.R. Veera Dandu, B. Peethala, S. V. Babu · Journal of The Electrochemical Society · 2010 · 64 citations

Engineering, Materials Engineering, Materials Science +17

Reverse selectivity – High silicon nitride and low silicon dioxide removal rates using ceria abrasive-based dispersions

P.R. Veera Dandu, Vamsi Devarapalli, S. V. Babu · Journal of Colloid and Interface Science · 2010 · 38 citations

Engineering, Materials Engineering, Materials Science +8

Influence of adhesion of silica and ceria abrasive nanoparticles on Chemical–Mechanical Planarization of silica surfaces

Dmytro O. Volkov, P.R. Veera Dandu, H. H. Goodman et al. · Applied Surface Science · 2011 · 29 citations

Natural Sciences, Materials Engineering, Materials Science +15

Silicon Nitride Film Removal During Chemical Mechanical Polishing Using Ceria-Based Dispersions

P.R. Veera Dandu, B. Peethala, H. P. Amanapu et al. · Journal of The Electrochemical Society · 2011 · 28 citations

Natural Sciences, Materials Engineering, Materials Science +17

Finite element modeling on electromigration of solder joints in wafer level packages

P.R. Veera Dandu, Xuejun Fan, Y. Liu et al. · Microelectronics Reliability · 2010 · 27 citations

Engineering, Electrical Engineering, Materials Engineering +16