Hyewon Shim

Hot carrier reliability characterization in consideration of self-heating in FinFET technology

Minjung Jin, Changze Liu, Jinju Kim et al. · 2016 · 71 citations

Engineering, Finfet Technology, Semiconductor Device +18

Technology scaling on High-K & Metal-Gate FinFET BTI reliability

Kyong Taek Lee, Wonchang Kang, Eun-Ae Chung et al. · 2013 · 56 citations

Materials Engineering, Electrical Engineering, Engineering +11

New Insight Into Negative Bias Temperature Instability Degradation During Self-Heating in Nanoscale Bulk FinFETs

Dokyun Son, Kyushik Hong, Hyewon Shim et al. · IEEE Electron Device Letters · 2019 · 31 citations

Engineering, Dc Stress, Nanoscale Bulk Finfets +16

Considering physical mechanisms and geometry dependencies in 14nm FinFET circuit aging and product validations

Sangwoo Pae, Hyun Chul Sagong, C. Liu et al. · 2015 · 29 citations

Device Modeling, Electrical Engineering, Engineering +15

Reliability characterization of 10nm FinFET technology with multi-V<inf>T</inf> gate stack for low power and high performance

Minjung Jin, Changze Liu, Jinju Kim et al. · 2016 · 26 citations

Reliability, Low Power, Electrical Engineering +12