Hot carrier reliability characterization in consideration of self-heating in FinFET technology

Minjung Jin, Changze Liu, Jinju Kim, +9

EngineeringFinfet TechnologySemiconductor DeviceDc Hci StressNanoelectronics +16

Technology scaling on High-K & Metal-Gate FinFET BTI reliability

Kyong Taek Lee, Wonchang Kang, Eun-Ae Chung, +9

Materials EngineeringElectrical EngineeringEngineeringVlsi DesignTechnology Scaling +9

New Insight Into Negative Bias Temperature Instability Degradation During Self-Heating in Nanoscale Bulk FinFETs

Dokyun Son, Kyushik Hong, Hyewon Shim, +2

IEEE Electron Device Letters

EngineeringDc StressNanoscale Bulk FinfetsSemiconductor DeviceNanoelectronics +14

Considering physical mechanisms and geometry dependencies in 14nm FinFET circuit aging and product validations

Sangwoo Pae, Hyun Chul Sagong, C. Liu, +12

Device ModelingElectrical EngineeringEngineeringProduct ValidationsExtensive 14Nm +13

Reliability characterization of 10nm FinFET technology with multi-V<inf>T</inf> gate stack for low power and high performance

Minjung Jin, Changze Liu, Jinju Kim, +10

ReliabilityLow PowerElectrical EngineeringReliability EngineeringEngineering +10

Reliability on Evolutionary FinFET CMOS Technology and Beyond

Kihyun Choi, Hyun Chul Sagong, Minjung Jin, +11

EngineeringVlsi DesignFinfet TechnologyScaled FinfetReliability Engineering +14

Modeling of FinFET Self-Heating Effects in multiple FinFET Technology Generations with implication for Transistor and Product Reliability

Hyun Chul Sagong, Kiho Choi, J. Kim, +7

Finfet Self-heating EffectsEngineeringFinfet Self-heatingNanoelectronicsFsh Effects +14

Enhanced Reliability of 7-nm Process Technology Featuring EUV

Kihyun Choi, Hyewon Shim, Junekyun Park, +11

IEEE Transactions on Electron Devices

EngineeringComputer ArchitectureScaled FinfetEnhanced ReliabilityReliability Engineering +14

Investigation of HCI effects in FinFET based ring oscillator circuits and IP blocks

Yoohwan Kim, Hyewon Shim, Minjung Jin, +3

EngineeringUnique Ring OscillatorReliability EngineeringCircuit SystemElectronic Packaging +16

Reliability Assessment of 3nm GAA Logic Technology Featuring Multi-Bridge-Channel FETs

Seongkyung Kim, Hyerim Park, Eunyu Choi, +5

EngineeringReliability AssessmentSemiconductor DeviceReliability EngineeringRf Semiconductor +14