Rudy J. M. Pellens - Concepedia

Author

Rudy J. M. Pellens

ASML (Netherlands)

Also Known As

R. Pellens, Rudy J. M. Pellens, Rudy Pellens

Publications

185

Citations

H-Index

Concepts

All Affiliations

ASML (Netherlands)Philips (Netherlands)Philips (Finland)Philips (Belgium)

About

Rudy J. M. Pellens is an author at ASML (Netherlands) specializing in engineering, mechanical engineering, and computer engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	6	6	164
2	Applied Physics	2	2	72
3	Computer Engineering	2	2	23
4	Medicine	1	1	30
5	Electrical Engineering	1	1	40

Rudy J. M. Pellens

Publications

164

Citations

H-Index

Page 1

	Year	Citations
Deep-ultraviolet–microelectromechanical systems stencils for high-throughput resistless patterning of mesoscopic structures M A F van den Boogaart, G. M. Kim, Rudy J. M. Pellens, Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena Materials ScienceWafer Scale ProcessingEngineeringBeam LithographyMicrofabrication	2004	61
Densely integrated microring resonator based photonic devices for use in access networks Edwin Klein, Patryk J. Urban, G. Sengo, Optics Express PhotonicsElectrical EngineeringOptical MaterialsOptical InterconnectsEngineering	2007	40
Novel aberration monitor for optical lithography Peter Dirksen, C.A.H. Juffermans, Rudy J. M. Pellens, Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE Circular Phase ObjectOptical MaterialsEngineeringMicroscopyOptic Design	1999	30
Effect of processing on the overlay performance of a wafer stepper Peter Dirksen, C.A.H. Juffermans, Ad Leeuwestein, Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE Wafer Scale ProcessingEngineeringIndustrial EngineeringMechanical EngineeringComputer Engineering	1997	12
Front- to back-side overlay optimization after wafer bonding for 3D integration Laurent Marinier, Wibo van Noort, Rudy J. M. Pellens, Microelectronic Engineering 3D Ic ArchitectureWafer Scale ProcessingEngineeringBack-side Overlay OptimizationAdvanced Packaging (Semiconductors)	2006	11
Simulations of a Non-planar Lithography and of Performance Characteristics of Arcade Microthermopiles for Energy Scavenging Vladimir Leonov, Ziyang Wang, Rudy J. M. Pellens, 5th International Energy Conversion Engineering Conference and Exhibit (IECEC) Materials ScienceEnergy HarvestingEngineeringBeam LithographyMicrofabrication	2007	10

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