Donggeon Kwak

A nanoclustered ceria abrasives with low crystallinity and high Ce3+/Ce4+ ratio for scratch reduction and high oxide removal rates in the chemical mechanical planarization

Na‐Yeon Kim, Goeun Kim, Hanna Sun et al. · Journal of Materials Science · 2022 · 50 citations

Engineering, Materials Engineering, Materials Science +15

Study on the effect of ceria concentration on the silicon oxide removal rate in chemical mechanical planarization

Donggeon Kwak, Seungjun Oh, Juhwan Kim et al. · Colloids and Surfaces A Physicochemical and Engineering Aspects · 2020 · 43 citations

Engineering, Materials Engineering, Materials Science +13

Effects of aging time in hydrogen peroxide-glycine-based Cu CMP slurry

Juhwan Kim, Donggeon Kwak, Jungjae Park et al. · Materials Science in Semiconductor Processing · 2021 · 20 citations

Engineering, Chemical Engineering, Aging +8

Effect of radial grooves pads on copper chemical mechanical polishing

Chulwoo Bae, Shinil Oh, Juhwan Kim et al. · Materials Science in Semiconductor Processing · 2022 · 20 citations

Engineering, Materials Engineering, Materials Science +8

Effect of Viscosity on Ceria Abrasive Removal during the Buff Clean Process

Juhwan Kim, Seok‐Jun Hong, Eungchul Kim et al. · ECS Journal of Solid State Science and Technology · 2020 · 17 citations

Engineering, Materials Engineering, Mechanical Behavior Of Materials +15