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A nanoclustered ceria abrasives with low crystallinity and high Ce3+/Ce4+ ratio for scratch reduction and high oxide removal rates in the chemical mechanical planarization

Materials ScienceMaterials EngineeringEngineeringMaterial ProcessingNanomaterialsCermetChemistryScratch ReductionNanoclustered Ceria AbrasivesChemical Mechanical PlanarizationAbrasive MachiningAbrasive Process