Effects of aging time in hydrogen peroxide-glycine-based Cu CMP slurry

Decomposition of Hydrogen Peroxide at Water−Ceramic Oxide Interfaces

Akira Hiroki, Jay A. LaVerne · The Journal of Physical Chemistry B · 2005 · 241 citations

Natural Sciences, Chemistry, Materials Science +17

Review on copper chemical–mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI)—An electrochemical perspective

Yair Ein‐Eli, David Starosvetsky · Electrochimica Acta · 2006 · 205 citations

Natural Sciences, Materials Engineering, Materials Science +17

Electrochemistry of Copper in Aqueous Glycine Solutions

Serdar Aksu, Fiona M. Doyle · Journal of The Electrochemical Society · 2001 · 153 citations

Natural Sciences, Chemistry, Materials Science +15

The Role of Glycine in the Chemical Mechanical Planarization of Copper

Serdar Aksu, Fiona M. Doyle · Journal of The Electrochemical Society · 2002 · 131 citations

Natural Sciences, Chemistry, Materials Science +16

Effect of glycine and hydrogen peroxide on chemical–mechanical planarization of copper

Sudipta Seal, S. C. Kuiry, B. Heinmen · Thin Solid Films · 2003 · 121 citations · Full text

Engineering, Materials Engineering, Materials Science +9