Concepedia

Chu-Hsuan Sha

CS

5

Publications

88

Citations

5

H-Index

2010

Active since

Affiliations

University of California, Irvine(Current)

Intel (United States)

Chu-Hsuan Sha is an author at University of California, Irvine specializing in engineering, materials science, and materials engineering.

Top concepts

EngineeringMaterial ScienceMicrostructureApplied PhysicsSurface ScienceMaterials EngineeringMicroelectronicsMicrofabricationElectronic PackagingIntegrated Circuits

Publications per year

2010–2012

5

Publications

5

40 $\mu{\rm m}$ Flip-Chip Process Using Ag–In Transient Liquid Phase Reaction

Wen P. Lin, Chu-Hsuan Sha, Chin C. Lee · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 25 citations

Materials Science, Joint Height, Wafer Scale Processing +13

Silver Microstructure Control for Fluxless Bonding Success Using Ag-In System

Pin J. Wang, Chu-Hsuan Sha, Chin C. Lee · IEEE Transactions on Components and Packaging Technologies · 2010 · 21 citations

Engineering, Si Chip, Integrated Circuits +16

Low-Temperature Solid-State Silver Bonding of Silicon Chips to Alumina Substrates

Chu-Hsuan Sha, Chin C. Lee · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 18 citations

Engineering, Si Chip, Silicon On Insulator +16

Microstructures of silver films plated on different substrates and annealed at different conditions

Wen P. Lin, Chu-Hsuan Sha, Pin J. Wang et al. · 2011 · 13 citations

Engineering, Different Substrates, Surface Nanotechnology +18

Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging

Chu-Hsuan Sha, Chin C. Lee · Journal of Electronic Packaging · 2011 · 11 citations

Engineering, Mechanical Engineering, High Strength Low Alloy Steel +17

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