Concepedia

Pin J. Wang

PJ

4

Publications

67

Citations

4

H-Index

2008

Active since

Affiliations

University of California, Irvine(Current)

Intel (United States)

Pin J. Wang is an author at University of California, Irvine specializing in microelectronics, materials science, and electrical engineering.

Top concepts

EngineeringApplied PhysicsSurface ScienceMaterial ScienceMicroelectronicsIntegrated CircuitsMaterials EngineeringElectrical EngineeringMicrofabricationAdvanced Packaging

Publications per year

2008–2010

4

Publications

4

Silver Microstructure Control for Fluxless Bonding Success Using Ag-In System

Pin J. Wang, Chu-Hsuan Sha, Chin C. Lee · IEEE Transactions on Components and Packaging Technologies · 2010 · 21 citations

Engineering, Si Chip, Integrated Circuits +16

Silver Joints Between Silicon Chips and Copper Substrates Made by Direct Bonding at Low-Temperature

Pin J. Wang, Chin C. Lee · IEEE Transactions on Components and Packaging Technologies · 2009 · 19 citations

Engineering, Si Chip, Integrated Circuits +18

Very High-Temperature Joints Between Si and Ag–Copper Substrate Made at Low Temperature Using InAg System

Jong Sung Kim, Pin J. Wang, Chin C. Lee · IEEE Transactions on Components and Packaging Technologies · 2008 · 16 citations

A new bonding technology dealing with large CTE mismatch between large Si chips and Cu substrates

Pin J. Wang, Jong Seung Kim, Chin C. Lee · 2008 · 11 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +19

Rows per page

1–4 of 4