Concepedia

Pin J. Wang

PJ

5

Publications

157

Citations

5

H-Index

2007

Active since

Affiliations

University of California, Irvine(Current)

Pin J. Wang is an author at University of California, Irvine specializing in materials science, engineering, and applied physics.

Top concepts

EngineeringMaterial ScienceApplied PhysicsMicrostructureSurface ScienceMicrofabricationElectronic PackagingMaterials EngineeringCorrosionMicroelectronics

Publications per year

2007–2011

5

Publications

5

Are Intermetallics in Solder Joints Really Brittle?

Chin C. Lee, Pin J. Wang, Jong Seung Kim · 2007 · 84 citations

Imc Layer, Engineering, Structural Materials +16

Intermetallic Reaction of Indium and Silver in an Electroplating Process

Pin J. Wang, Jong Seung Kim, Chin C. Lee · Journal of Electronic Materials · 2009 · 34 citations · Full text

Engineering, Thick Silver Layer, Metallic Nanomaterials +19

Silver Flip-Chip Technology by Solid-State Bonding

Pin J. Wang, Chin C. Lee · Journal of Electronic Packaging · 2010 · 15 citations

Engineering, Si Chip, Integrated Circuits +16

Microstructures of silver films plated on different substrates and annealed at different conditions

Wen P. Lin, Chu-Hsuan Sha, Pin J. Wang et al. · 2011 · 13 citations

Engineering, Different Substrates, Surface Nanotechnology +18

Fluxless Bonding of Large Silicon Chips to Ceramic Packages Using Electroplated Eutectic Au/Sn/Au Structures

Pin J. Wang, Jong Seung Kim, Chin C. Lee · Journal of Electronic Materials · 2009 · 11 citations · Full text

Engineering, Large Silicon Chips, Wafer Scale Processing +21

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